Extreme Ultraviolet: Light up the Bright Future of the World
The semiconductor manufacturing process is becoming increasingly complex, including various processes such as thin film deposition, lithography, etching, packaging, and measurement. The semiconductor structure is also approaching physical limits. To continue Moore‘s Law, it is necessary to strengthen the development of lithography technology. As a leading manufacturer in the semiconductor industry, “The Nano Patterning Technology Development” (nPTD) Division established by TSMC's primary task is to be responsible for the development of lithography technology, constantly challenging the miniaturization of component line width in order to break through performance barriers.“
Extreme ultraviolet (EUV) technology is a type of lithography used in the manufacturing of semiconductor chips. It uses light with a wavelength of 13.5 nanometers, which is much shorter than the 193 nm wavelength used in traditional lithography. This allows for the creation of smaller and more complex features on the semiconductor chip. EUV technology involves the use of a series of mirrors and lenses to focus the EUV light onto the semiconductor wafer. The process requires a vacuum environment to prevent interference from air molecules. EUV lithography is considered a critical technology for the continued advancement of semiconductor manufacturing, as it enables the production of more powerful and efficient chips. EUV technology is expected to become increasingly important in the semiconductor industry, particularly as manufacturers seek to produce smaller and more powerful chips for use in a wide range of applications.
修習「專題演講」課程同學須出席。
Students who take the "Colloquium" course must attend.